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Sekisui Chemical Singapore (Pte.) Ltd.
Plastic Core Solder Balls   Conductive Fine Particles
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Assembly Applications Conductive Fine Particles
Assembly Applications Conductive Fine Particles
Size Plastic core thickness * Final controllable Size
Conductive Metal layer Solder layer
800 750 5 20 800 25
500 452 4 20 500 15
300 264 3 15 300 10
150 132 2 7 150 5
100 84 2 6 100 5
* These compositions are our standard. Ball size, thickness of Conductive Metal layer, Solder layer are available on your request.
We are developing solder ball under 100 m. Please consult with us. Contact us

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