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Sekisui Chemical Singapore (Pte.) Ltd.
Plastic Core Solder Balls   Conductive Fine Particles
  For Detailed Information For Detailed Information
Assembly Applications Conductive Fine Particles
About excellent reliability
By using plastic ball as a core having low Young's moduluses, solder hardness is moderated and the stress on a ball is a relaxed.
As a result, the stress doesn't concentrate on the solder joint and the life is prolonged.
In a temperature cycle test by customers, SOL gets a high evaluation result.
Customer's Evaluation result 1     
Micropearl SOL500m :Plastic core/Cu/eutectic solder(Sn/Pb)
Temperature Cycle Test Condition : -65(10 minutes) - 150(10 minutes)
PKG size : 16x10mm2 pitch : 0.8mm pin account : 0.8mm
Courtesy : Hyundai MicroElectronics Co.
"CSP Board Level Reliability Testing of Pb-free Sn-Ag-X and Polymer-core Ball"

Customer's Evaluation result 2 WL-CSP     
Micropearl SOL-300m : Plastic core/Cu/Pb free solder(Sn/Ag)
Temperature Cycle Test Condition : -40(10 minutes) - 125(10 minutes)
Weibull Cumulatove Hazard Analysis of TCT on Board

Customer's Evaluation result 3     
Micropearl SOL-500m :Plastic core/Cu/eutectic solder(Sn/Pb)
Temperature Cycle Test Condition : -55(30 minutes) - 125(30 minutes)
Ceramic board
PKG size : 15.5x15.5mm pitch : 0.8mm pin account : 324
Courtesy : Matsushita Kotobuki Industries,Ltd.
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