Micropearl SOL (Conductive Fine Particles)


	Solder Plated Plastic Balls that maintain gaps evenly to attain high reliability.
		Micropearl SOL is a solder plated true sphere with a plastic core and was designed for mounting chips to circuit board. Unlike conventional solder balls which often cracks under the heat cycle test, these precise, stress-relaxing plastic balls do not crack and have better spacing control.SOL is very suitable for future miniaturized, high-reliability IT devices. If you have a ploblem about solder joint, please contact us.

Feature of SOL

Three major features of SOL

Excellent reliability

By stress relaxation of plastic core,
the stress doesn't concentrate on the solder joint.
In a temperature cycle and drop test, SOL gets a high evaluation result.

Gap holding ability

It doesn't occur to transform bolow the core size.SOL holds ideally gap between board and package.

Holding transmission lines

Because SOL doesn't transform below own core size,the transmission line is not out of order from a design value.

There are electric characteristics and heat mission's date etc. Please contact us.

Application

Wafer Level CSP	Big difference of CTE between silicon chip and board.
Modules for High-frequency	Gap holding ability for exact designed frequency. Big difference of CTE between ceramic and board.

SOL's composition and product line up MORE

They are the structure of SOL, and a kind list.

If you have a problem about solder joint, please contact us.

We propose the composition suitable for use material.
Please feel free to contact us from contact form.

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